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1 ионное легирование
1) Engineering: implant, implant doping, implantation, implantation doping, implantation process (примесей), ion implantation, ion implantation doping, ion implantation process, ion-beam implantation, ion-implantation process2) Microelectronics: all-ion-implant process, ion-implant doping, ion-implantation doping, ion-implantation processing3) Solar energy: ion-assisted dopingУниверсальный русско-английский словарь > ионное легирование
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2 ионная имплантация
1) Engineering: implant, implant doping, implantation, implantation doping, implantation process, ion implantation, ion implantation doping, ion-beam implantation, ion-implantation process2) Microelectronics: all-ion-implant process, ion-implant doping, ion-implantation doping, ion-implantation processingУниверсальный русско-английский словарь > ионная имплантация
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3 ионно-имплантационное легирование
Electronics: ion-implantation dopingУниверсальный русско-английский словарь > ионно-имплантационное легирование
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4 легирование методом ионной имплантации
Electronics: ion-implantation dopingУниверсальный русско-английский словарь > легирование методом ионной имплантации
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5 ионное легирование
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6 легирование методом ионной имплантации
Русско-английский физический словарь > легирование методом ионной имплантации
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7 легирование
1) Medicine: legation2) Engineering: alloy addition, alloying, impurity doping, impurity doping process3) Automobile industry: finishing4) Metallurgy: alloy building, alloyage5) Electronics: impurity-dopant incorporation, introduction of impurities6) Oil: doping7) Automation: alloying addition8) Makarov: alloying (металлов), doping (напр. полупроводников), doping (полупроводников), implantation
См. также в других словарях:
Doping (semiconductor) — In semiconductor production, doping intentionally introduces impurities into an extremely pure (also referred to as intrinsic) semiconductor for the purpose of modulating its electrical properties. The impurities are dependent upon the type of… … Wikipedia
Monolayer doping — (MLD) is a well controlled, wafer scale surface doping technique first developed at the University of California, Berkeley, in 2007.[1] This work is aimed for attaining controlled doping of semiconductor materials with atomic accuracy, especially … Wikipedia
Ion implantation — is a materials engineering process by which ions of a material can be implanted into another solid, thereby changing the physical properties of the solid. Ion implantation is used in semiconductor device fabrication and in metal finishing, as… … Wikipedia
Plasma-immersion ion implantation — (PIII) [cite book | title = Materials Science of Thin Films | author = Milton Ohring | publisher = Academic Press | year = 2002 | isbn = 0125249756 | url = http://books.google.com/books?id=SOt yFjV xwC pg=PA267… … Wikipedia
Collision cascade — A classical molecular dynamics computer simulation of a collision cascade in Au induced by a 10 keV Au self recoil. This is a typical case of a collision cascade in the heat spike regime. Each small sphere illustrates the position of an atom, in… … Wikipedia
Wafer (electronics) — Polished 12 and 6 silicon wafers. The flat cut into the right wafer indicates its doping and crystallographic orientation (see below) … Wikipedia
integrated circuit — Electronics. a circuit of transistors, resistors, and capacitors constructed on a single semiconductor wafer or chip, in which the components are interconnected to perform a given function. Abbr.: IC Also called microcircuit. [1955 60] * * * ▪… … Universalium
Covalent superconductor — Covalent semiconductors are such solids as diamond, silicon, germanium, silicon carbide and silicon germanium where atoms are linked by covalent bonds. Most of those materials, at least in their bulk form, are well studied and rarely hit the… … Wikipedia
Microfabrication — Synthetic detail of a micromanufactured integrated circuit through four layers of planarized copper interconnect, down to the polysilicon (pink), wells (greyish) and substrate (green) Microfabrication is the term that describes processes of… … Wikipedia
Semiconductor device fabrication — Semiconductor manufacturing processes 10 µm 1971 3 µm 1975 1.5 µm 1982 … Wikipedia
Erythropoietin — Available structures … Wikipedia